Issue 4(2), pp. 33-40, 2026

Abstract

This paper examines the vacuum impregnation of a high-temperature superconductors – based conductor with In52/Sn48 eutectic solder as a method for increasing the mechanical, thermal, and operational stability of the composite structure. The relevance of the study lies in the fact that modern high-power composite superconductors used in magnetic systems, particularly for controlled fusion devices, have a complex multilayer architecture and contain internal voids that impair heat dissipation and increase sensitivity to electrodynamic loads, which can lead to an unexpected loss of the superconducting state. It is shown that vacuum impregnation removes air and moisture from internal cavities, ensures melt penetration into hard-to-reach areas of the structure, and forms a more homogeneous, heat-conducting and mechanically bonded composite. Particular attention is paid to the selection of In52/Sn48 solder, which has a low melting point, high ductility, good wettability, and is suitable for temperature-sensitive and cryogenic applications. The main technological stages of the process are discussed, including preheating, vacuum treatment, melt feeding, cavity filling, and directional solidification. It is shown that optimization of process parameters is key to achieving high-quality filling and minimizing structural defects.

Keywords: composite high-temperature superconductors; tin-indium solder; eutectic; vacuum impregnation.