Article
Stand for passive thermal cycling tests of power semiconductor components in complex temperature
I. Y. Zhdanov
Moscow Aviation Institute (National Research University), Volokolamskoe Highway, 4, 125993, Moscow, Russia
M. A. Ostapchuk
Moscow Aviation Institute (National Research University), Volokolamskoe Highway, 4, 125993, Moscow, Russia
e-mail: ostapchukma@mai.ru
DOI: https://doi.org/10.62539/2949-5644-2024-6-1-74-81
Abstract
Cryogenic cooling of power electronics is a promising direction, which in the future can become an alternative to other types of cooling in systems with superconducting devices. At the same time, the increase in the specific power and efficiency of power electronic converters is associated with unexplored reliability. This manuscript contains approaches for studying the reliability of power electronics, as well as experimental data from passive thermal cycling tests.
Keywords: cryoelectronics; cryogenic cooling of power electronics; thermal cycling; reliability testing.
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